單面拋光機
單面拋光機(SSP50DPAW)裝載旋轉式機械機構並且擁有精密的控制系統。此機型具備自動盤面修整功能控制磨盤性能並且可執行精密複雜的研磨與拋光工作並且提供精確與穩定之生產工件。 可對應直徑360至最大485mm陶瓷盤與2吋至最大6吋之藍寶石基板。 此機型具備研磨與拋光多樣化材質能力並且達到精密加工水準。
應用
• 藍寶石基板 • 半導體晶元 • 碳化鎢件 • 陶瓷工件 • 閥門 • 水晶玻璃 • 振盪器零件
規格
Description |
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| Items | SSP-36DPAW | SSP-50DPAW | |
| Polishing plate | Plate material | Oxygen free Cu , Resin-Cu | Oxygen free Cu |
| Or Tin plate (*option) | or Tin plate(*option) | ||
| Plate size | Φ910mm | Φ1240mm | |
| Revolution control | By inverter. | Home position. | |
| Plate cooling | Cooling water jacket | Cooling water jacket | |
| Pressure plate | P. Plate | 4 axles. | 4 axles. (driving force system individually) |
| Block size | 360mmΦ | 485mmΦ | |
| Applied pressure | By cylinder | By cylinder | |
| Work block | - | Auto Centering | |
| Facing unit | Mounting type. | Square type. | |
| Capacity / batch | 4 inch wafer x 24 Pcs | 4 inch wafer x 40 Pcs | |
| 6 inch wafer x 12 Pcs | 6 inch wafer x 24 Pcs | ||
| Utility | Electricity | AC220V, 3Phase, 60Hz | AC220V, 3Phase, 60Hz |
| Pneumatic | 0.5~0.8 Mpa | 0.5~0.8 Mpa | |
| Etc | Machine Size | 1350 *2250 *1920 mm | 1640 *3029 *2575 mm |
| Machine Weight | 3,500Kg. | 5,500Kg. | |
| Controller | Touch Screen (Proface) | Touch Screen (Proface) | |
| Signal lamp with alarm | |||
• 良好的線徑控制、線材的外形均一 • 傑出的線材張力與強度 • 優異的切割效率 • 相比傳統加工方式，縮短 50% 的切割時間 • 加工精準度與完工表面佳 • 可搭配各種不同設備應用