Wax Bonding M/C
WEC developed the Automatic Wax Bonding Machine (WMS-series for the Sapphire back thinning process. This unique process is the thinnest and fastest wax bonding equipment with easy operation from its computerized control system. The WEC Automatic Liquid Wax Bonding Machine has great precision, high speed and lowered consumables and labor costs.
Application
>Multiple wafer wax bonding (Materials: Sapphire, Silicon, LitaO3, LiNbO3, SiC, Fine Ceramic & Various Metal materials)
>Applicable to 2", 2.5", 3", 4", 6"….etc.
>Customized multiple wafer wax bonding system for various wafer & block sizes
Wax bonding time less than 15 minutes
Wax thickness can be controlled below 3 microns
Operating with automatic robot arms to avoid scratching
Customized multiple wafer wax bonding system for various wafer & block sizes