Diamond Wire
WEC has more than 20 years of experience in the manufacture and applications of super hard abrasives. With the unique technique of electroplate (Willeock® ) & polymer glue (Fransteyen®), we have successfully developed the excellent diamond wire that displays outstanding cutting and slicing performance, the perfect completion quality and new applications that are highly competitive.
Application
This product can be applied to various materials such as Sapphire Ingot, Silicon Ingot (mono/poly), Precision Glass Ceramic, Quartz, Crystal, Synthetic Crystal, etc.
Specification
| EP Dia. Wire Diameter | Application |
| Ø 420 μm (Core Ø 350 μm ) | Cropping |
| Ø 350 μm (Core Ø 250 μm ) | Slicing |
| Ø 250 μm (Core Ø 180 μm ) | Slicing |
| Ø 200 μm (Core Ø 160 μm ) | Slicing |
| Ø 150 μm (Core Ø 120 μm ) | Slicing |
| Ø 140 μm (Core Ø 120 μm ) | Slicing |
| Ø 130 μm (Core Ø 110 μm ) | Slicing |
| Ø 120 μm (Core Ø 100 μm ) | Slicing |
| Ø 110 μm (Core Ø 90 μm ) | Slicing |
| Ø 100 μm (Core Ø 80 μm ) | Slicing |
| RB Dia. Wire Diameter | Application |
| Ø 250 μm (Core Ø 180 μm ) | Slicing |
| Ø 145 μm (Core Ø 120 μm ) | Slicing |
| Ø 135 μm (Core Ø 110 μm ) | Slicing |
| Ø 125 μm (Core Ø 100 μm ) | Slicing |
• Good wire diameter control and uniform appearance. • Outstanding wire strength and tension technology. • Excellent cutting ability. • Compared to the conventional process, it reduces 50% of cutting time . • good machining accuracy and surface completion. • can be used with varopis device applications.