Epoxy
Gigabond , two component, consists of resin and hardener. This epoxy adhesive is specially designed for ingot slicing. Quick cure, high adhesion type which can be removed by hot water. This adhesive features no serious disgusting odor, non-flammability and non-evaporative characteristics. customizationiIs available upon request. Perfect for slicing and bonding of work pieces such as silicon and sapphire ingots, boule and blocks.
Application
This product is specially applied to Semiconductor, Crystal, Porcelain, and Magnetic material ingot/block cutting.
Specification
GigaBond | V1 | V7 | ||
Viscosity cps (25°C)C) | A | B | A | B |
165000 | 42000 | 25000 | 25000 | |
± 15000 | ± 7000 | ± 5000 | ± 5000 | |
Appearance | Rust | White | Rust | White |
Gel Time | 3 ~ 5 (min) | 5 ~ 8 (min) | ||
Bond Strength | After 0.5 Hours | After 2 Hours | ||
80 (kg/cm2) | 100 (kg/cm2) | |||
Max. Strength | After 1 Hours | After 6 Hours | ||
100 (kg/cm2) | 200 (kg/cm2) | |||
Hardness | 85 ± 5D | 85 ± 5D | ||
Mixing Ratio | A : B = 1 : 1 | |||
Application | Sapphire slicing | Bonding Fixture | ||
Debonding | 70°C Water | 200°C Oven | ||
Debonding Time | 10 min | 30 min | ||
Package | A : 1KG / B:1KG |
GigaBond | V9 | |
Viscosity cps (25°C) | A | B |
150000 | 50000 | |
± 15000 | ± 10000 | |
Appearance | Rust | White |
Gel Time | 3 ~ 7 (min) | |
Bond Strength | After 2 Hours | |
100 (kg/cm2) | ||
Max. Strength | After 4 Hours | |
150 (kg/cm2) | ||
Hardness | 85 ± 5D | |
Mixing Ratio | A : B = 1 : 1 | |
Application | Sapphire slicing | Bonding Fixture |
Debonding | 70°C Water | 200°C Oven |
Debonding Time | 20 min | 30 min |
Package | A : 1KG / B:1KG |
GigaBond | S4 | S7 | ||
Viscosity cps (25°C) | A | B | A | B |
70000 | 16000 | 20000 | 3000 | |
± 10000 | ± 5000 | ± 5000 | ± 1000 | |
Appearance | Rust | Milky | Rust | Milky |
Gel Time | 20 (min) | 10 (min) | ||
Bond Strength | After 2 Hours | After 2 Hours | ||
200 (kg/cm2) | 200 (kg/cm2) | |||
Max. Strength | After 6 Hours | After 6 Hours | ||
240 (kg/cm2) | 240 (kg/cm2) | |||
Hardness | 85 ± 5D | 85 ± 5D | ||
Mixing Ratio | A : B = 2 : 1 | |||
Application | Silicon Slicing | |||
Debonding | 75°C Water | |||
Debonding Time | 15 min | |||
Package | A : 1KG / B:0.5KG |
• Excellent adhesive strength • Quick hardening • Easy to be debonded by hot water without using solvent or oven • Easy to be blended (Weight Ratio A : B = 2 : 1) • Good for large area mounting • Non-flammability, no disgusting smell • Customization is available upon request