Single Side Lapping M/C
The Automatic Grinding Machine (WHG-250PC) is design for Sapphire back thinning process. This is the equipment is the fastest grinding speed and the largest productivity grinding machine in the field. The WEC Automatic grinding machine is easy to operate due to its computerized control system and has great precision, high speed and lowered consumables and labor costs.
• One Touch Operation • Automatic thickness control • Applicable to the DOG maintenance free grinding wheel. • Multiple workpiece process to increase productivity. • Applicable to wafers with difference sizes (2"~8") • Statistic of Process Control (SPC) for friendly management. • Multiple protection design to avoid human negligence. • Windows operating system for maximum data compatibility. • Simple operation and maintenance.